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Details Title Postdoctoral AI Researcher in AI/ML for Foundation Models, Scientific Applications, and AI Systems School Faculty of Arts and Sciences Department/Area Kempner Institute at Harvard
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processes for energy storage applications. The researcher is expected to use solution-based synthesis approaches (e.g., electrospinning, slot-die coating, and 3D printing) to fabricate battery electrodes and
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Helmholtz-Zentrum Dresden-Rossendorf - HZDR - Helmholtz Association | Dresden, Sachsen | Germany | about 2 months ago
Researcher (R3) Application Deadline 16 Aug 2026 - 22:00 (UTC) Country Germany Type of Contract To be defined Job Status Other Offer Starting Date 1 Nov 2026 Is the job funded through the EU Research Framework
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semiconductors and semiconductors for water splitting applications). We will then use these materials to fabricate highly efficient water splitting devices and develop operando XPS methods to characterise the same
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Positions Application Deadline 26 Jul 2026 - 23:59 (Europe/Zagreb) Country Croatia Type of Contract Temporary Job Status Full-time Hours Per Week 40 Offer Starting Date 7 Jul 2026 Is the job funded through
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Postdoc Positions Application Deadline 26 Jul 2026 - 23:59 (Europe/Zagreb) Country Croatia Type of Contract Temporary Job Status Full-time Hours Per Week 40 Offer Starting Date 7 Jul 2026 Is the job funded
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Application-driven Composable Distributed Storage. The candidate will be able to make research contributions in understanding and efficient use of distributed data storage and I/O subsystems for High
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) Positions Postdoc Positions Application Deadline 31 Jul 2026 - 15:00 (Europe/Warsaw) Country Poland Type of Contract Temporary Job Status Full-time Hours Per Week 40 Offer Starting Date 17 Aug 2026 Is the job
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Details Title Postdoctoral position in AI for Engineering Applications School Harvard John A. Paulson School of Engineering and Applied Sciences Department/Area Applied Math Position Description
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applications. The ideal candidate will possess strong analytical and experimental skills to address complex challenges related to packaging dynamics, product protection, and sustainable material performance