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, please visit the institute's website: https://www.is2m.uha.fr/ . The postdoctoral researcher will work within the Plasma Polymerization and Coatings team, under the scientific supervision of Dr. Aissam
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: Four (4) years Preferred Qualifications: Experience performing research tasks: Six (6) years Proven success in securing external funding. Experience with AFM, Raman spectroscopy, TERS, TEPL
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for high-aspect-ratio vertical interconnects characterise the results (SEM, AFM, XCT, optical microscopy) for geometric accuracy, durability and interfacial strength -validate scalability and
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interconnects characterise the results (SEM, AFM, XCT, optical microscopy) for geometric accuracy, durability and interfacial strength -validate scalability and sustainability: less material waste, better energy
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and biosensors using microscopic techniques. Measure properties with force spectroscopy. Apply magnetic force microscopy (MFM). Use Kelvin probe force microscopy (KPFM). Execute AFM assays in liquid
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fabricated devices using techniques such as SEM, AFM and other metrology tools Collaborate with multidisciplinary teams on device development, fabrication workflows, and process integration Contribute
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School graduates over a thousand students who are ready to take on great ambitions and challenges. For more details, please view: https://www.ntu.edu.sg/eee We are looking for a Research Fellow to lead and
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National Aeronautics and Space Administration (NASA) | Pasadena, California | United States | about 1 month ago
candidate with strong cleanroom fabrication tool experience, particularly in materials characterization methods such as ellipsometry, AFM, SEM, TEM, XRD, SIMS, or related techniques. Experience with
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, please view https://www.ntu.edu.sg/newri . We are looking for a Research Fellow to support the research project on “Novel High Performance Piezoelectric Thin Film Composite (TFC) Nanofiltration/Reverse
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of nanoscale devices, preferably using atomically thin materials; their characterisation; photolithography and e-beam lithography; thin-film deposition; wet and reactive ion etching; SEM and AFM characterisation