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-generation technologies for understanding and managing the subsurface. This position is embedded within the national Sectorplan Earth and Environmental Sciences (AMW) programme and contributes to strategic
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department is highly interdisciplinary with informatics researchers working closely together with practicing cardiologists to advance the use of AI for personalised treatment. The ultimate goal is to be able
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24 Sep 2026 Job Information Organisation/Company Delft University of Technology (TU Delft) Research Field Technology » Quantum technology Researcher Profile Recognised Researcher (R2) Application
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23 Sep 2026 Job Information Organisation/Company Delft University of Technology (TU Delft) Research Field Engineering » Maritime engineering Engineering » Mechanical engineering Researcher Profile
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Vacancies PostDoc position on Wafer Bonding Physics for 3D Chip Integration Key takeaways Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked
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Join TU Delft to uncover the biology of cellular robustness in an industrial yeast process and translate your discoveries into innovative genome engineering strategies. Job description You will join
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18 Sep 2026 Job Information Organisation/Company University of Twente (UT) Research Field Engineering » Materials engineering Engineering » Mechanical engineering Researcher Profile Recognised
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27 Sep 2026 Job Information Organisation/Company University of Amsterdam (UvA) Research Field Chemistry » Analytical chemistry Chemistry » Physical chemistry Researcher Profile Recognised Researcher
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12 Sep 2026 Job Information Organisation/Company Delft University of Technology (TU Delft) Research Field Engineering » Electrical engineering Researcher Profile Recognised Researcher (R2
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Postdoc Position in AI Foundation Models for Crop Microbiomes Faculty: Faculty of Science Department: Department of Information and Computing Sciences Hours per week: 36 to 40 Application