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dynamic RHU Urology 3D consortium. Where to apply Website https://emploi.cnrs.fr/Offres/CDD/UMR5031-CORAME0-063/Default.aspx Requirements Research Field Chemistry Education Level PhD or equivalent Research
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these areas is a strong advantage: Experience with neural tissue culture and/or iPSC differentiation Experience with 3D in vitro culture and Organ-on-Chip fabrication Experience with image analysis and/or
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Universitat Politècnica de Catalunya (UPC)- BarcelonaTECH | Barcelona, Cataluna | Spain | about 3 hours ago
Requirements Knowledge: Multimodal sensor data fusion. Video Analysis and 3D Vision. 3D point cloud analysis (Detection, Location and Segmentation with LiDAR sensors). Visual recognition in images and videos
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Helmholtz Zentrum München - Deutsches Forschungszentrum für Gesundheit und Umwelt | Grafing bei München, Bayern | Germany | about 2 months ago
. Our major research fields are AI-based organ mapping, tissue engineering and precision medicine in cancer treatments. Sophisticated technologies such as 3D tissue imaging or molecular profiling are
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? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description About the project The Introini Lab ( https://mpzpm.mpg.de/research/viola-introini
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imaging research group and project “Natural Heritage 3D”. This collaborative project between Visual Computing @ DTU Compute, DTU Physics, Copenhagen University, and the Natural History Museum aims to
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from 3D electron diffraction, X-ray and neutron data. Data analysis and comparisons with simulations: Perform in-depth analysis and interpretation of magnetic moments and structural disorder from
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Posting Details Student Title Classification Information Quick Link https://chapman.peopleadmin.com/postings/40251 Job Number SE212124 Position Information Department or Unit Name Fowler School of
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Summary Information Job Description Summary The successful candidate will contribute to ongoing projects with applications in microelectronics, data analysis, PCB design, and 3D printing technologies
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Description Summary The successful candidate will contribute to ongoing projects with applications in microelectronics, data analysis, PCB design, and 3D printing technologies. This position offers