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developing high-performance materials, manufacturing processes and products. By developing specific computer-aided technologies, we accelerate materials based innovation including the digitalization
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Wafer Grinding research activities Chemical Mechanical Polishing (CMP) is an enabling technology for the nanoelectronics industry. CMP uses a chemical formulation that contains abrasive nanoparticles
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of academia and industry. This objective is achieved by: The performance of an individual research project under the direction of an internationally renowned Group Leader, in a creative and stimulating
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