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Wafer Grinding research activities Chemical Mechanical Polishing (CMP) is an enabling technology for the nanoelectronics industry. CMP uses a chemical formulation that contains abrasive nanoparticles
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29 Mar 2024 Job Information Organisation/Company IMEC Research Field Chemistry Engineering Researcher Profile First Stage Researcher (R1) Country Belgium Application Deadline 15 Apr 2024 - 23:59
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encouraged to: Develop fundamental understanding of TMDs growth mechanisms by combining experimental analysis via a complementary set of advanced characterization techniques with theoretical models. Design
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, the specific nature of the channel to dielectric interface impacts electron transport in modes at variance with silicon technology [3]. The PhD research topic focuses on investigating new innovative