6 mechanical positions at IMEC in Belgium

Researcher Chemical Mechanical Polishing

Programme? Not funded by an EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description As a Researcher Chemical Mechanical Polishing you will support CMP and

R&D Process Step Engineer Chemical Mechanical Polishing

Mechanical Polishing (CMP) is an enabling technology for the nanoelectronics industry. CMP uses a chemical formulation that contains abrasive nanoparticles to polish wafers to remove unwanted dielectric

R&D Process Step Engineer Chemical Mechanical Polishing

Job related to staff position within a Research Infrastructure? No Offer Description Supporting CMP R&D activities in Back-End of Line IC Processing Chemical Mechanical Polishing (CMP) is an enabling

PhD position | Single crystalline 2D channel material by area-selective deposition for atomically thin transistors

various types of surface sensitive spectroscopy. As such, you gain insight in the CVD precursor adsorption and diffusion. Ultimately, these observations can enable you to propose a growth mechanism. Based

PhD Position | Homo- and heterostructures with 2D single crystals by selective deposition for advanced logic applications

encouraged to: Develop fundamental understanding of TMDs growth mechanisms by combining experimental analysis via a complementary set of advanced characterization techniques with theoretical models. Design

PhD Position | Innovative process strategies to deposit high permittivity dielectrics on two-dimensional (2D) materials

. Groven et al., (2018). Two-Dimensional Crystal Grain Size Tuning in WS2  Atomic Layer Deposition: An Insight in the Nucleation Mechanism. Chemistry of materials, 30 (21), 7648-7663 Type of work: 40