28 Materials-Science "University of North Texas Health Science Center" positions at IMEC in Belgium
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21 May 2024 Job Information Organisation/Company IMEC Research Field Physics Chemistry Engineering » Materials engineering Researcher Profile Recognised Researcher (R2) Established Researcher (R3
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Infrastructure? No Offer Description Join an international and multidisciplinary team to research on contacting 2D channel materials. The Silicon semiconductor technology has been the main driver in the last 60
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department at imec, with strong links to the Material Engineering department of KU Leuven. Type of work: 40% experimental, 30% characterization, 20% data analysis, 10% literature study and writing Supervisor
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enrich your competences and skills through the PhD trajectory at KUL and the imec academy development center. [1] K. S. Novoselov et al., “2D materials and van der Waals heterostructures,” Science, vol
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this reference code on your application form. Requirements Research FieldAllEducation LevelMaster Degree or equivalent Skills/Qualifications Required background: Master in Physics/ Materials Science
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), 2927-2938 [8] Shi Y., et al. (2021). “Engineering Wafer-Scale Epitaxial Two-Dimensional Materials through Sapphire Template Screening for Advanced High-Performance Nanoelectronics.” ACS Nano 15, 6, 9482
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27 May 2024 Job Information Organisation/Company IMEC Research Field Chemistry » Physical chemistry Chemistry Physics Engineering » Materials engineering Researcher Profile First Stage Researcher
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24 Apr 2024 Job Information Organisation/Company IMEC Department IMOMEC Research Field Engineering » Materials engineering Engineering » Chemical engineering Researcher Profile Recognised Researcher
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27 May 2024 Job Information Organisation/Company IMEC Research Field Engineering » Industrial engineering Other Researcher Profile First Stage Researcher (R1) Country Belgium Application Deadline 27
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technology for the nanoelectronics industry. CMP uses a chemical formulation that contains abrasive nanoparticles to polish wafers to remove unwanted dielectric or metallic material and planarize its surface