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15 May 2024 Job Information Organisation/Company Ghent University Research Field Chemistry » Other Engineering » Chemical engineering Engineering » Materials engineering Engineering » Mechanical
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Wafer Grinding research activities Chemical Mechanical Polishing (CMP) is an enabling technology for the nanoelectronics industry. CMP uses a chemical formulation that contains abrasive nanoparticles
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engineering, mechanical engineering or geosciences. The candidate should have an interest in renewable energy. Good mathematical and programming skill is an asset. The joint thesis will be carried out between
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mathematical background You completed a Master's degree program in Applied Mathematics or Electrical, Information, Mechanical (or related) Engineering You have good programming skills and experience (Matlab
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, knowledge of Abaqus™ or other commercial FEA packages;Familiar with mechanics of materials and experimental and computational techniques;Master’s degree in mechanical engineering, computational mechanics
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11 May 2024 Job Information Organisation/Company Ghent University Research Field Chemistry » Other Engineering » Materials engineering Engineering » Mechanical engineering Engineering » Other
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mechanisms involving genetic, epigenetic and chromatin organisation factors governing the cell-type specific response to ARS mutations. Therefore, an integrative genome-wide cis-regulatory network analysis
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11 May 2024 Job Information Organisation/Company Ghent University Research Field Chemistry » Other Engineering » Materials engineering Engineering » Mechanical engineering Engineering » Other
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11 May 2024 Job Information Organisation/Company Ghent University Research Field Chemistry » Molecular chemistry Chemistry » Other Engineering » Materials engineering Engineering » Mechanical
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well as the available public data suggest mechanisms involving genetic, epigenetic and chromatin organisation factors governing the cell-type specific response to ARS mutations. Therefore, an integrative genome-wide cis