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100686BR Campus: Tempe Process Engineer Sr Job Description The Advanced Electronics and Photonics Core Facility (AEP) is expanding and hiring a Process Engineer Sr, Packaging. In this period of
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, the Advanced Electronics and Photonics Core facility is a recent addition to the Arizona State University Core facilities network. Created from the Flexible Electronics and Display Center (FEDC) upon
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of interest include, but are not limited to, Packaging for High Frequency and Photonics Applications, Fabrication of Advanced Semiconductor Packages (2.5D, FOWLP, and 3D), Electromagnetic and Electro-Thermal
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retention of research faculty, postdocs, academic professionals and university staff; new employee onboarding; and working with department supervisors to ensure new hire checklist functions have been
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ferroelectric semiconductors for electronics, optoelectronics, piezoelectronics, memory, and quantum devices and systems, Materials and devices for quantum photonics, quantum sensing, computing and communication