Research Fellow (3D-IC Package Fault Localisation and Failure Analysis)

23 Jan 2024
Job Information

Organisation/Company

NATIONAL UNIVERSITY OF SINGAPORE

Research Field

Engineering
Engineering
Chemistry
Engineering
Physics

Researcher Profile

First Stage Researcher (R1)

Country

Singapore

Application Deadline

21 Feb 2024 - 00:00 (UTC)

Type of Contract

Other

Job Status

Full-time

Is the job funded through the EU Research Framework Programme?

Not funded by an EU programme

Is the Job related to staff position within a Research Infrastructure?

No

Offer Description

Job Description

The Electrical and Computer Engineering (ECE) Department of National University of Singapore (NUS) is in search of candidate for a research fellow position to support 3D-IC package fault localisation and failure analysis (FA) techniques with Artificial Intelligence (AI)/Machine Learning (ML)/Deep Learning (DL) capability. 

You will work closely with our researchers, students, and professors, including Co-Investigators from A*STAR: I2R and IMRE, and several industry collaborators to understand and derive insights from scientific experiments and data. 

The successful candidate will be assisting in the research to enable a variation-tolerant and technology-agnostic ML guided system to achieve 10x or greater reduction in time taken for FA process; reducing from weeks/months of fault identification to hours. This in turn allows problems to be identified and resolved quickly leading to faster time-to-market, yield and productivity improvements.

Responsibilities will involve:

• Develop magnetic field imaging (MFI) workflow and perform correlative study with Lock-in Thermography (LIT).
• Develop ML algorithms to guide MFI data processing.
• Develop ML algorithms to capture X-ray image of 3D-IC defects.
• Develop ML algorithms to extract features and identify defects.
• Develop 3D-IC forward predictive models (i.e. include chip and circuit blocks) and ML feature set to integrate with MFI tool interfaces.
• Lead research article publications and invention disclosures.
• Lead new equipment purchases and commissioning.
• Assume super-user role of multiple equipment (ownership and maintenance) and leadership role for safety.
• Provide trainings and certifications to new users.

(Interested applicants should send their curriculum vitae via email to [email protected] ).

Qualifications

• PhD in Electrical, Electronics, Mechanical, Chemical Engineering, Physics, Material Science or its equivalent from a reputable University/Institute is preferred, or equivalent related experience. 
• Candidate with experience in microelectronic research, characterisation, metrology, electrical testing, FA and strong in data analysis will have advantage. Knowledge of AI/ML/DL development and TCAD modelling. 
• Strong analytical and problem-solving skills.
• Motivated and possesses effective communication skills including writing and presenting.
• Ability to work independently and collaborate within a diverse team.
• Open to Fixed Term Contract

More Information

Location: Kent Ridge Campus
Organization: College of Design and Engineering
Department : Electrical and Computer Engineering
Employee Referral Eligible: No
Job requisition ID : 23132

Requirements
Additional Information
Where to apply

Website

https://www.timeshighereducation.com/unijobs/listing/363848/research-fellow-3d-…

STATUS: EXPIRED