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thermal characterization of prototype devices, including measurements under vacuum and cryogenic conditions Integration and testing of probes in scanning probe instrumentation Collaboration with academic
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followed. During conventional 3D imaging, the goal is to resolve every single voxel of the 3D volume. However, the underlying dynamic changes can be temporally sparse and highly localized, meaning that only
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followed. During conventional 3D imaging, the goal is to resolve every single voxel of the 3D volume. However, the underlying dynamic changes can be temporally sparse and highly localized, meaning that only
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to precisely thin the otic capsule through the ear canal, enabling high-resolution imaging of the cochlea without open surgery or manipulation of the eardrum. Preliminary studies in porcine temporal bones
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industry. Our group combines precision experiments, advanced imaging, and modeling to uncover the physics of tin droplets under extreme conditions of laser irradiation. We have established a strong track
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and magneto-optical imaging. Experience with thin and ultrathin films, interfaces, and heterostructures is highly desirable. Familiarity with conventional materials-characterization techniques and an
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. Sparse sensing, optimization, or Bayesian experimental design. Machine learning for imaging. Synchrotron experiment experience. Semiconductor devices or metrology. We offer We offer a fully funded
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linking: PVD process → thin-film morphology → electrode microstructure → electrochemical behaviour → full-cell performance The two successful candidates will investigate how the morphology and physical
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Postdoc (f/m/d) Methods Development for the Micromechanical Characterization and Modeling of the ...
strategies for developing innovative structural materials for nuclear applications. To do so, we study radiation resistance using ion-irradiated samples, which means characterizing very thin layers close to
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for high-performance infrared photodetectors and imaging systems. We invite applications for two postdoctoral positions focused on next-generation SWIR and room-temperature MWIR photodetectors based on III–V